Printed Circuit Boards (PCBs) can be designed appropriately to meet regulatory schemes and standards such as Federal Communications Commission (FCC), Industry Canada (IC), the European Union Directive, RED and EMC directives, MIL-STD-461G, RTCA DO160G, etc., by following the guidelines below:
Minimize the use of long, unshielded conductors.
Place power and ground planes on separate layers.
Use proper grounding techniques, such as star grounding.
Minimize the use of vias and stubs.
Implement effective shields, such as metal enclosures or metallic layers within the PCB.
Properly terminate signal lines to reduce reflections.
Properly place and size decoupling capacitors.
Use low-loss materials for the PCB substrate.
Follow guidelines for trace spacing and width to reduce emissions.
Consider the effects of high-frequency signals on the PCB layout.